Study on ESL Simulation and Influencing Factors of DC-link Capacitors

DONG Xiaoliang; WU Zeyi; CHEN Deling; ZHANG Yan; ZHAO Dan; HAO Linlin; LIU Xianbo; ZHANG Chengcheng

doi:10.14044/j.1674-1757.pcrpc.2026.04.004

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Study on ESL Simulation and Influencing Factors of DC-link Capacitors

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Study on ESL Simulation and Influencing Factors of DC-link Capacitors
直流支撑电容器ESL仿真及影响因素研究
Xincheng(Liaoning)Power Capacitor Technology Co., Ltd., Liaoning Yingkou 115007, China
Wuhai Power Supply Company, Inner Mongolia Corporation Limited, Inner Mongolia Wuhai 016000, China
Vol. 47, Issue 4, Pages: 28-40(2026)
DOI：10.14044/j.1674-1757.pcrpc.2026.04.004
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DONG Xiaoliang, WU Zeyi, CHEN Deling, et al. Study on ESL Simulation and Influencing Factors of DC-link Capacitors[J]. Power Capacitor & Reactive Power Compensation, 2026, 47(4): 28-40.
DOI：

DONG Xiaoliang, WU Zeyi, CHEN Deling, et al. Study on ESL Simulation and Influencing Factors of DC-link Capacitors[J]. Power Capacitor & Reactive Power Compensation, 2026, 47(4): 28-40. DOI： 10.14044/j.1674-1757.pcrpc.2026.04.004.

摘要

柔性直流支撑电容器是模块化多电平换流器（MMC）子模块中的关键储能元件，其等效串联电感（ESL）直接影响系统开关过电压与可靠性。本文以平面单块心子排列结构为研究对象，采用COMSOL Multiphysics建立整机电感仿真模型，系统研究了元件直径（并联数）、铜板厚度、薄膜宽度、电极结构形式及长高比五类关键因素对整机ESL的影响规律。研究表明：电极系统是整机ESL的绝对主导因素，贡献比达97.1%～98.3%，元件自身贡献不足3%；元件直径影响较小（增幅6.6%），铜板厚度从0.4 mm增至2.0 mm，ESL仅降低0.19%，铜板厚度影响不显著；薄膜宽度从150 mm减至60 mm降幅达44.5%，铜条+编织线结构ESL为整体铜板的1.20～1.63倍，长高比L/H从0.62增至2.57可降低ESL约75.7%。采用短路放电法对5个典型样品进行试验验证，仿真与试验最大相对误差不超过5.0%，验证了模型的有效性，为低电感直流支撑电容器的优化设计提供了系统性定量依据。

Abstract

VSC-HVDC-link capacitors are key energy storage components in sub-modules of modular multilevel converters (MMC)

and their equivalent series inductance (ESL) directly affects the system's switching overvoltage and reliability. In this paper

the planar single-cell core arrangement structure is taken as the study object and a integrated inductance simulation model using COMSOL Multiphysics is set up. The influence of such five key parameters as element diameter (number of parallel elements)

copper plate thickness

film width

electrode configuration

and length-to-height ratio on the overall ESL is systematically investigated. The study results show that the electrode system is the absolutely dominant factor in the overall ESL

contributing 97.1%~98.3%

while the contribution of the components themselves is less than 3%. The element diameter has a relatively minor effect (with increase of 6.6%). When the copper plate thickness is increased from 0.4mm to 2.0 mm

the ELS is decreased by only 0.19%

indicating that the effect of the copper plate thickness is not significant. The ELS is decreased by 44.5 when the film width is reduced from 150 mm to 60 mm. The copper strip with braided wire configurations exhibits an ESL 1.20~1.63 times higher than that of the solid copper plates. Moreover

increasing the aspect ratio ( L/H) from 0.62 to 2.57 yields

an ESL reduction of about 75.7%. The short circuit discharge method is used to experimentally validate five typical samples. The maximum relative error between simulations and measurement does not exceed 5.0%

which verifies the effectiveness of the model and provides a systematic quantitative basis for the optimal design of low inductance DC-link capacitors

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