Research on Temperature Rise Charactersitics of DC-link Capacitor for VSC-HVDC Converter Valve

LI Jiantao; NING Xiaobo; WANG Huichao; LI Shaohui; LI Tianyong; LI Minghao

doi:10.14044/j.1674-1757.pcrpc.2026.04.005

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Research on Temperature Rise Charactersitics of DC-link Capacitor for VSC-HVDC Converter Valve

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Research on Temperature Rise Charactersitics of DC-link Capacitor for VSC-HVDC Converter Valve
柔性直流输电换流阀用直流支撑电容器温升研究
Lion Great Exploit(Hebi)Electronic Technology Co., Ltd., Henan Hebi 458030, China
Vol. 47, Issue 4, Pages: 41-46(2026)
DOI：10.14044/j.1674-1757.pcrpc.2026.04.005
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LI Jiantao, NING Xiaobo, WANG Huichao, et al. Research on Temperature Rise Charactersitics of DC-link Capacitor for VSC-HVDC Converter Valve[J]. Power Capacitor & Reactive Power Compensation, 2026, 47(4): 41-46.
DOI：

LI Jiantao, NING Xiaobo, WANG Huichao, et al. Research on Temperature Rise Charactersitics of DC-link Capacitor for VSC-HVDC Converter Valve[J]. Power Capacitor & Reactive Power Compensation, 2026, 47(4): 41-46. DOI： 10.14044/j.1674-1757.pcrpc.2026.04.005.

摘要

温升性能对电容器至关重要，温升的高低直接影响电容器的寿命。为了降低柔性直流输电换流阀用直流支撑电容器（简称柔直电容器）的温升，研究了影响柔直电容器温升的因素及规律。通过对试验数据的分析，得出影响电容器温升的因素繁多，几乎涵盖了电容器的方方面面。降低柔直电容器温升应从多方面进行改进和优化，材料方面，建议选取低损耗的PP介质，导体选用电阻率低的紫铜，在保证极壳绝缘性能的前提下选择尽可能大导热系数的聚氨酯。设计方面，建议金属化膜低方阻区宽度占薄膜总幅宽的20%～30%为宜，单个心子不宜过大，控制其直径在68～78 mm为宜，铜带电流密度建议选择≤1.5 A/mm

。工艺方面，建议卷绕间洁净度至少10 000级，喷金气压选择应0.3 MPa～0.4 MPa之间为宜，焊接建议采用恒温自动化焊接，灌注建议采用真空度低于100 Pa的真空灌注为宜。试验方面，尽量采取接近实际运行的状态进行试验，以消除影响温升试验结果的干扰因素，得到尽可能准确的试验结果。

Abstract

Temperature rise performance is crucial for capacitors

as the level of temperature rise directly affects their service life. In order to reduce the temperature rise of DC-link capacitor for VSC-HVDC converter valves (referred to as VSC HVDC capacitor)

the influencing factors and their regularities affecting the temperature rise of such capacitors are investigated. It is found through analysis of experimental data that numerous factors influence capacitor temperature rise

covering almost every aspect of the capacitors. To reduce the temperature rise of VSC HVDC capacitors

improvements and optimizations shall be carried out in multiple aspects. In terms of materials

it is recommended to select PP dielectric with low loss

choose copper with low resistivity for the conductors

and

on the premise of ensuring the insulation performance between the electrode and the case

select polyurethane with as high thermal conductivity as possible. In terms of design

it is recommended that the width of the low-sheet-resistance zone of the metallized film account for 20

% to 30% of the total film width. The individual winding core shall not be excessively large

with its diameter being preferably controlled within the range of 68 to 78 mm. The current density of the copper strip is suggested to be no more than 1.5 A/mm

. In terms of processing

the cleanliness of the winding workshop shall be at least Class 10 000

the spraying pressure shall be controlled between 0.3 MPa and 0.4 MPa. The constant-temperature automated welding is recommended for soldering

and vacuum impregnation with a vacuum level below 100 Pa is preferred for the filling process. In terms of testing

the tests shall be conducted under conditions as close as possible to actual operating conditions

so as to eliminate interfering factors that may affect the temperature rise test results and to obtain the most accurate possible test results.

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