Analysis on the Influence of Film Drawing and Coating Processes on Edge Surface Breakdown in the Outer Layer of Circular Components

LEI Qiaoshu; ZUO Qianglin; HAO Yu

doi:10.14044/j.1674-1757.pcrpc.2026.04.008

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Analysis on the Influence of Film Drawing and Coating Processes on Edge Surface Breakdown in the Outer Layer of Circular Components

POWER CAPACITOR & REACTIVE POWER COMPENSATION | Key Technologies for the Full-chain Localization of Polypropylene Film Capactors

Analysis on the Influence of Film Drawing and Coating Processes on Edge Surface Breakdown in the Outer Layer of Circular Components
拉膜、镀膜工艺对圆元件外层中留边沿面击穿的影响分析
Wuxi Sunking Power Capacitor Co., Ltd., Jiangsu Wuxi 214177, China
Jiashan Sunking Power Electronic Capacitor Co., Ltd., Zhejiang Jiashan 314112, China
Vol. 47, Issue 4, Pages: 60-67(2026)
DOI：10.14044/j.1674-1757.pcrpc.2026.04.008
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LEI Qiaoshu, ZUO Qianglin, HAO Yu. Analysis on the Influence of Film Drawing and Coating Processes on Edge Surface Breakdown in the Outer Layer of Circular Components[J]. Power Capacitor & Reactive Power Compensation, 2026, 47(4): 60-67.
DOI：

LEI Qiaoshu, ZUO Qianglin, HAO Yu. Analysis on the Influence of Film Drawing and Coating Processes on Edge Surface Breakdown in the Outer Layer of Circular Components[J]. Power Capacitor & Reactive Power Compensation, 2026, 47(4): 60-67. DOI： 10.14044/j.1674-1757.pcrpc.2026.04.008.

摘要

本文通过对X厂家和Y厂家同规格金属化膜在相同工艺下制备的圆元件进行试验验证，发现X厂材料制备的元件更容易发生“炸膜”现象，最终明确“炸膜”现象与拉膜、镀膜工艺有一定的相关性。“炸膜”现象实为圆元件金属化膜外层中留边沿面击穿现象。通过对中留边沿面击穿的机理进行分析。首先，中留边边缘极板电场畸变严重在低电压下放电，会增加沿面击穿的风险；其次，中留边基膜表面的粗糙度和表面污秽的程度，也会直接影响到中留边沿面击穿场强。针对“炸膜”现象提出改进措施，如增加中留边宽度、优化蒸镀工艺，调整电晕面的极性强度、优化屏蔽油涂刷工艺，减小屏蔽油涂刷不均匀性等，均可进一步降低沿面击穿的概率，提升金属化膜质量。X厂家针对一定规格厚度薄膜进行工艺优化，有效抑制了元件中留边沿面击穿的发生。

Abstract

In this paper

the experimental verification on circular components fabricated from metallized films of the sme specifications from manufactuers X and manufacturer Y under identical process is performed

finding that the components prepared with materials from the former Manufactirer are more prone to the“film burst”phenomenon. Ultimately

it is confirmed that the“film burst”phenomenon has a certain correlation with the film drawing and coating processes. The“film burst”phenomenon is actually the edge surface breakdown occurring in the retained margin on the outlayer of the metallized film of the circular component. The mechanism of this edge surface breakdown in the retained margin is analyzed. First

the severe electric field distortion at the edge of the middle reserved edge plate leads to discharge at low voltages

which increases the risk of surface breakdown. Then

both the roughness of the surface of the base film of the middle reserved edge and the degree of surface contamination will also directly affect the surface breakdown field strength of the middle reserved edge. To address the“film burst”phenomenon

such improvement measures as increasing the width of the middle reserved edge

optimizing the evaporation process

adjusting the polarity and intensity of the corona surface

and optimizing the shielding oil brushing process as well as reducing the non-uniformity of the shielding oil brushing are proposed so to reduce the probability of surface flashover and improve the quality of the metallized film further. The former manufacturer has effectively suppressed the occurrence of surface flashover at the middle reserved edge of components by optimizing the process for films of a certain specification and thickness.

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