HUA ZHENG, WANG ZHAOMENG, XU MENGLEI, et al. Calculation Analysis of 3D Temperature Field Algorithm of High-voltage All-film Capacitor. [J]. Power capacitor & reactive power compensation, 2017, 38(2): 94-99.
HUA ZHENG, WANG ZHAOMENG, XU MENGLEI, et al. Calculation Analysis of 3D Temperature Field Algorithm of High-voltage All-film Capacitor. [J]. Power capacitor & reactive power compensation, 2017, 38(2): 94-99. DOI: 10.14044/j.1674-1757.pcrpc.2017.02.018.
Calculation Analysis of 3D Temperature Field Algorithm of High-voltage All-film Capacitor
摘要
为了获得1.2倍额定电压、环温55°C运行工况下高压全膜电容器内部温度场分布
分析了高压全膜电容器内部结构
建立了高压全膜电容器三维温度场仿真模型
并基于ANSYS Fluent进行求解
得到高压全膜电容器整体温度场分布
仿真结果表明:电容器外壳由头部至尾部温度逐渐升高
外壳顶部温度高于底部
侧卧时心子最热点集中在心子尾段
立放时心子最热点集中在心子中段。
Abstract
For obtaining the temperature field distribution in the high-voltage all-film capacitor at the operation condition of 1.2 times rated voltage and ambient temperature of 55 °C
in this paper
the internal structure of the high voltage all-film capacitor is analyzed
the simulation model of three-dimensional temperature field of high-voltage all-film capacitor is set up and solved based on ANSYS Fluent and the complete temperature field distribution of the high-voltage all-film capacitor is obtained. It is shown by the simulation result that the temperature rise gradually from top to the tail of the capacitor case
the case top temperature is higher than that the case bottom
and if the horizontal layout
the hottest point inside the core is concentrated on the tail section