DONG QI, LI HAOLIN, DANG ZHIMIN. Design Analysis and Performance Regulation of High Square Resistance Metallized Dielectric Film Electrode for Capacitor. [J]. Power capacitor & reactive power compensation, 2024, 45(1): 128-139.
DOI:
DONG QI, LI HAOLIN, DANG ZHIMIN. Design Analysis and Performance Regulation of High Square Resistance Metallized Dielectric Film Electrode for Capacitor. [J]. Power capacitor & reactive power compensation, 2024, 45(1): 128-139. DOI: 10.14044/j.1674-1757.pcrpc.2024.01.018.
Design Analysis and Performance Regulation of High Square Resistance Metallized Dielectric Film Electrode for Capacitor
as one of the key elements of high voltage capacitor
is used widely in in the fields of power systems
pulse power and new-energy vehicles (NEVs) by virtue of its outstanding resistance in high-temperature and high-voltage. Also
the metallized film possesses excellent self-healing properties
the extremely thin metal electrodes are very prone to fracture and failure under large current
which is a crucial factor affecting safe operation of capacitor. In addition
the issue of large volume and small capacity also severely restricts the application of thin film capacitor
thus giving rise to forming the technical barriers. In the process of the development of miniaturization and high capacity for the metallized dielectric film
except for the influence of new dielectric film material itself
the effect of the structure design of ultra-thin high-square-resistance metallized electrode on the performance of thin film capacitors is also gradually beginning to emerge and become prominent. In this paper
the electrode structure design of high-square-resistance metallized film in recent years
as well as the application and development of surface/interface engineering in the electrode structure design are reviewed. Meanwhile
the limitations and problems of designing metallized electrode structure based on the electrode thickness
elements and patterning from the past to the present are summarized. The role of interface in electrical properties with the thickness of metal electrode changing from micron-to nano-scale is analyzed. The relationship between self-healing properties and electrode structure interaction is emphasized. Combined with the relevant interface research methodology of medium film metallization concerning the ultra-thin metallized film interface in optoelectronic semiconductors
this work provides an important reference on how to develop the structural design and performance control of ultra-thin metallized film by using interface for the storage energy ultra-thin metallized film in the field of new energy in the future. The prediction of macro-electrical performance regulation via the structural and interface design of metallized film in the micro-fundamental domain is systematically described
and the localization of the key technologies related to the film capacitors is fundamentally proposed.
关键词
金属化介质薄膜高方阻电极结构表界面工程电气特性
Keywords
metallized dielectric filmhigh square resistanceelectrode structuresurface and interface engineeringelectrical characteristic