直流支撑电容器对壳局放性能的影响因素分析

左强林; 何冰辉; 黄杰; 倪琰

doi:10.14044/j.1674-1757.pcrpc.2026.04.003

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直流支撑电容器对壳局放性能的影响因素分析

电力电容器与无功补偿 | 聚丙烯薄膜电容器全链条国产化关键技术

直流支撑电容器对壳局放性能的影响因素分析
Analysis of Factors Influencing the Partial Discharge Performance of DC-link Capacitor to the Case
嘉善赛晶电容器有限公司，浙江嘉善 314112
2026年47卷第4期页码：20-27
DOI：10.14044/j.1674-1757.pcrpc.2026.04.003
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左强林, 何冰辉, 黄杰, 等. 直流支撑电容器对壳局放性能的影响因素分析[J]. 电力电容器与无功补偿, 2026,47(4):20-27.

ZUO Qianglin, HE Binghui, HUANG Jie, et al. Analysis of Factors Influencing the Partial Discharge Performance of DC-link Capacitor to the Case[J]. Power Capacitor & Reactive Power Compensation, 2026, 47(4): 20-27.
左强林, 何冰辉, 黄杰, 等. 直流支撑电容器对壳局放性能的影响因素分析[J]. 电力电容器与无功补偿, 2026,47(4):20-27. DOI： 10.14044/j.1674-1757.pcrpc.2026.04.003.

ZUO Qianglin, HE Binghui, HUANG Jie, et al. Analysis of Factors Influencing the Partial Discharge Performance of DC-link Capacitor to the Case[J]. Power Capacitor & Reactive Power Compensation, 2026, 47(4): 20-27. DOI： 10.14044/j.1674-1757.pcrpc.2026.04.003.

摘要

本文分析了聚氨酯胶的基本性能参数介电常数、电导率和损耗角正切对直流支撑电容器对壳交流局部放电性能的影响规律；分析了温度对聚氨酯固化化学反应的影响机制及剩余生胶比例的影响；分析了聚氨酯主剂中官能团没有完全反应存在的问题；结合巴申定律分析计算了注胶真空度对电容器局部放电影响的规律；阐述了用于直流支撑电容器的双组分聚氨酯胶的三种固化工艺：高温固化、常温固化和混合固化，对聚氨酯胶的性能的影响。得到了聚氨酯的基本性能参数变化对电容器局放稳定性的影响机制和温度对直流支撑电容器影响的机制，提出了聚氨酯的固化温度越低，聚氨酯固化的均一性越差，对壳局放及其稳定性越差的结论；获得了注胶真空压强越高，微气隙的击穿场强越高的推论；提出聚氨酯的基本性能参数不能出现突变的建议。

Abstract

In this paper

the influence of such basic performance parameters of polyurethane (PU) adhesives as dielectric constant

conductivity

and tangent of loss angle on the AC partial discharge performance of DC-link capacitors to the case is analyzed. The influence of temperature on the curing reaction of polyurethane and the effect of residual uncured rubber are also analyzed. The problem of incomplete reaction of functional groups in PU main agent is analyzed. The influence of the vacuum degree of injection on the partial discharge of the capacitor is calculated in combination with the Paschen's law. Such three curing processes of two-component PU adhesives for DC-link capacitors as high-temperature curing

normal temperature curing

and mixed curing and their influence on the performance of PU adhesives are described. The influence mechanism of the changes in the basic performance parameters of PU on the stability of capacitor partial discharge and the influence mechanism of temperature on DC-link capacitors are obtained. It is concluded that the lower the curing temperature of PU

the worse the uniformity of PU curing

and consequently the worse the case partial discharge performance and its stability. It is inferred that the higher the vacuum pressure during potting

the higher the breakdown field strength of micro-voids. The the suggestion that the basic performance parameters of PU should not exhibit abrupt changes is proposed.

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references

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