HUA ZHENG, HOU ZHIJIAN, QI LINGNA, et al. Internal Temperature Field Simulation Analysis of Assembled Shunt Capacitor Based on Fluent. [J]. Power capacitor & reactive power compensation, 2016, 37(4): 37-42.
HUA ZHENG, HOU ZHIJIAN, QI LINGNA, et al. Internal Temperature Field Simulation Analysis of Assembled Shunt Capacitor Based on Fluent. [J]. Power capacitor & reactive power compensation, 2016, 37(4): 37-42. DOI: 10.14044/j.1674-1757.pcrpc.2016.04.007.
基于Fluent的集合式并联电容器内部温度场仿真分析
摘要
温度是影响电容器运行性能及寿命的关键因素
为了获得集合式并联电容器内部的温度场分布
论文分析了集合式并联电容器内部结构及热量的产生和散失机理
在ANSYS Workbench 15.0中建立了集合式并联电容器温度场三维仿真模型
并利用有限体积法进行了求解
得到了集合式并联电容器的内部温度场分布、外壳温度和最热点温度
仿真结果及方法可以为集合式并联电容器散热结构的优化设计及内部最热点温度的控制提供参考。
Abstract
Temperature is a key factor affecting performance and operation life of the capacitor. For obtaining the temperature field distribution inside the assembled shunt capacitor
in this paper
the internal structure and mechanism of heat generation and loss of the capacitor are analyzed. The threedimensional simulation model of the temperature field of the capacitor is set up in ANSYS Workbench15.0 and is solved by finite volume method(FVM)and the internal temperature filed distribution
shell temperature as well as the temperature and position of the hottest spot of the assembled shunt capacitor are obtained. The simulation result and method can provide reference for optimization design of radiation structure and control of the internal hottest spot temperature of the capacitor.