XU MENGLEI, WANG ZHAOMENG, WANG XUN, et al. Temperature Field Simulation of T Pattern Metallized Safety Film Capacitor. [J]. Power capacitor & reactive power compensation, 2018, 39(3): 75-81.
XU MENGLEI, WANG ZHAOMENG, WANG XUN, et al. Temperature Field Simulation of T Pattern Metallized Safety Film Capacitor. [J]. Power capacitor & reactive power compensation, 2018, 39(3): 75-81. DOI: 10.14044/j.1674-1757.pcrpc.2018.03.014.
T pattern metallized safety film capacitor not only has self-healing performance of general selfhealing capacitor
the secondary protection action provided by its modular electrode prevents further development of self-healing failure
and the temperature variation caused by structure change in electrode greatly affects the operation performance and lifetime of capacitor.In this paper
on the basis of introducing the internal heat generation and dissipation
the temperature field of T pattern metallized safety film capacitor with ANSYS Workbench 15.0 is simulated so to explore the ratio of fuse width and segment width
influence of ambient temperature on the highest temperature of the capacitor
deduce the corresponding relationship between various influence factors and the highest temperature and provide calibration method for the key dimension designation of T pattern metalized safety film capacitor.
关键词
T型金属化安全膜安全膜电容器温度场仿真分析
Keywords
T pattern metallized safety filmsafety film capacitortemperature fieldsimulation analysis