WANG XUN, CHEN WEI, XU MENGLEI, et al. Study on Self-healing Failure Process in Metallized Film Capacitor Element. [J]. Power capacitor & reactive power compensation, 2018, 39(4): 54-58.
WANG XUN, CHEN WEI, XU MENGLEI, et al. Study on Self-healing Failure Process in Metallized Film Capacitor Element. [J]. Power capacitor & reactive power compensation, 2018, 39(4): 54-58. DOI: 10.14044/j.1674-1757.pcrpc.2018.04.010.
金属化膜电容器元件自愈失败过程研究
摘要
金属化膜电容器的自愈性虽能在发生局部击穿时自动恢复绝缘
但持续性放电引发自愈失败仍能导致灾难性故障的发生。为探其自愈失败过程
对电容器元件施加较高直流电压
通过并联电容间接测量击穿点处的电压和电流
分析自愈失败时的发展过程
推导其击穿点的阻抗特性。试验结果表明:自愈失败是以一个较大的自愈过程为先导
在元件彻底击穿之前
会有持续时间为几毫秒的频繁自愈过程
这些自愈电流的峰值随电压的减小而下降;在元件彻底击穿的过程中
随着持续放电的进行
击穿点的等效电阻在逐渐减小
阻值最小值已基本接近完全短路。本文通过对自愈失败过程的研究
为熔丝保护和安全膜设计提供参考。
Abstract
Although the self-healing metallized film capacitor recovers insulation automatically in case of partial breakdown
yet self-healing failure due to sustaining discharge can still lead to occurrence of failure caused by sustained discharge still leads to catastrophic fault. For exploring self-healing failure process
HVDC voltage is applied on the capacitor element
the voltage and current at the breakdown point is measured indirectly by the shunt capacitor so to analyze the development process of the self-healing failure and deduce the impedance feature of its breakdown point. It is shown by the test result that the self-healing failure is the bigger self-healing process as a lead
the frequent self-healing process with sustaining time of several ms is existed before complete breakdown of the element
and the peak of these self-healing current decreases with decreasing voltage. During the breakdown period of element
with the sustaining discharge
the equivalent resistance of the breakdown point is reduced gradually and the minimum resistance is basically close to complete short circuit. The study of the self-healing failure process provides reference for the fuse protection and safe film design.
关键词
金属化膜电容器自愈失败阻抗特性
Keywords
metallized film capacitorself-healing failureimpedance characteristic